The article explains the unique SI and PI challenges in 3D IC designs by contrasting them with traditional SoCs.

For products with moderate volumes, shorter life cycles or requirements to serve geographically diverse markets, SoMs offer ...

The built-in web server, which is hosted on the ESP32, allows monitoring through any device connected to the local network, ...

Zug, Switzerland, November 19th, 2025, ChainwireSupra, the vertically integrated Layer 1 powering MultiVM smart contract ...

Mirabilis Design’s VisualSim offers model-based design creation and simulation for application spaces from chip design to automotive applications. Mirabilis Design’s founder, Deepak Sankar, talked to ...

A seventh-grade student in Karachi has created a smart stick for visually impaired individuals, offering sound and vibration ...

One of the defining challenges of advanced packaging lies in maintaining traceability as dies move through multiple ...

ACADIA 2025 brought together leading voices in tech and design to share how algorithms, software and data analysis will ...

This startup has developed an AI copilot for mechanical engineers. At the heart of the innovation is a Large Mechanical Model ...

See how models, tools and evals fit together in Agentic AI, plus tips on pitfalls, deployment gaps, and where no code options ...

D-Tools Cloud now provides a dynamic, interactive environment for mapping out device interconnects on a project.

Power, performance, and area metrics alone are no longer sufficient to capture the full range of design goals.