IP companies have heralded a new age in platform-based design for years – ever since semiconductor integration capacity reached the point where entire systems could theoretically be integrated into a ...

SystemC standards group Open SystemC Initiative (OSCI) has released the SystemC TLM (transaction-level modeling) standard version 1.0. The TLM standard kit, which can be downloaded under an open ...

SystemC users urged to provide feedback on TLM-2 Draft 2 by January 31st SAN JOSE, Calif. December 4, 2007 The Open SystemC Initiative (OSCI), an independent non-profit organization dedicated to ...

The last several years have seen strong adoption of transaction-level models using SystemC TLM 2.0. Those models are used for software validation and virtual prototyping. For functional verification, ...

THAME, England--(BUSINESS WIRE)--The Open Virtual Platforms (OVP) initiative (www.OVPworld.org) has announced the release of a reference virtual platform of the ARM Integrator development board using ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest professional association advancing technology for humanity, today announced that the IEEE Standards Association (IEEE-SA) Standards Board ...

Transaction-level modeling – an abstracted representation of design IP above the RT level — continues to grow in importance for architectural exploration, performance analysis, building virtual ...

MOUNTAIN VIEW, Calif., Jan 12, 2010 -- Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of ...

At the 45th Design Automation Conference in June 2008, the Open SystemC Initiative (OSCI) announced the ratification of the TLM-2.0 standard, enabling interoperability for transaction ...

High-level synthesis (HLS) continues to grow in favor among beleaguered system-on-a-chip (SoC) design teams. At the same time, EDA vendors continue to increase the capabilities of their tools. The ...