As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and ...
Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a ...
MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...
Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco ...
Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...
Avago Technologies is highlighting its 4G/LTE Band 7 duplexer1, a part of to its growing line of high isolation, 2 x 2.5 mm Film Bulk Acoustic Resonator (FBAR) duplexers for mobile handsets and data ...
Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
LONDON-- (BUSINESS WIRE)--Technavio has been monitoring the fan-out wafer level packaging market and it is poised to grow by USD 1.94 billion during 2020-2024, progressing at a CAGR of over 16% during ...
Dr. Navid Asadi’s group takes a look at wafer to panel level chip packaging. This is the six of a mutlipart series on chip packaging technologies. Navid Asadi is an assistant professor in the ...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...
CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...
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