In general, the distribution of copper foil on a PCB board is very complicated and difficult to accurately model. Modeling can result in uneven distribution of copper foil during PCB manufacturer ...

With IC process geometries shrinking below 45 nm and many applications requiring lower power consumption, thermal control is starting to become a first-order concern for not only IC engineers but also ...

ASUS announced the launch of its new line of motherboards for the upcoming Intel platform. The ASUS X79 motherboards sporting the LGA 2011 sockets will replace the older generation of X58 chipset ...

This article is part of the TechXchange: Cool Designs. New families of power semiconductors require new approaches in board design for thermal and power management. A number of board level solutions ...

THERM-A-GAP™ GEL 120 is a single-component thermal gel for dissipating heat which is available in buckets and other packaged ...

What is thermal clad and what is its role in thermal management on circuit boards? Why does thermal clad use either copper or aluminum in the base layer? Is thermal clad compatible with any circuit ...

Online columnist Lou Pechi argues that the now-popular techniques for cooling chips and pc boards are becoming inadequate as levels of power dissipation continue to rise Lou Pechi, online columnist ...