Rattunde is introducing the new ACS + CFMcurve Integrated Sawing and Machining Center, which uses sophisticated electronics, servo motors and custom-developed software to control the saw blade during ...

Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

Honeycomb core materials, such as aramid, aluminium, and fibreglass, are used in areas such as interiors, winglets, spoilers and many other parts in commercial and military aircraft, helicopters and ...

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance semiconductor assembly packaging technology ...

A trio of companies is attempting to reduce the waste caused by wafer-sawing processes by growing crystalline silicon on relatively cheap foil. NREL has teamed up with DOE's Oak Ridge National ...