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SK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centers

Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND flash. The super dense NAND chips which will power these UFS 4.1 ICs are ...
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Intel and SK hynix close NAND business deal: Intel gets $1.9 billion, SK hynix gets IP and employees

Intel and SK hynix this week finalized their nearly $8.85 billion transaction of Intel's NAND flash memory operations, completing a two-part process that began in 2020. On Thursday, Intel received a ...