Nvidia and TSMC will announce on Friday their first completed U.S.-made wafer that will eventually become Blackwell chips for AI purposes, Nvidia first tells Axios. Why it matters: This milestone ...
Third Generation 5nm Wafer-Scale Engine (WSE-3) Powers Industry’s Most Scalable AI Supercomputers, Up To 256 exaFLOPs via 2048 Nodes SUNNYVALE, Calif.--(BUSINESS WIRE)--Cerebras Systems, the pioneer ...
Cerebras Systems and the federal Department of Energy's National Energy Technology Laboratory today announced that the company's CS-1 system is more than 10,000 times faster than a graphics processing ...
Johns Hopkins researchers have discovered new materials and a new process that could advance the ever-escalating quest to make smaller, faster, and affordable microchips used across modern electronics ...
Physicists have spent decades building colossal machines to hurl subatomic particles to near light speed, but the newest frontier in accelerator technology is smaller than a fingernail. By etching ...
Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...
Imagine a machine so advanced it operates with light invisible to the human eye, etching circuits onto silicon wafers at scales smaller than a virus. This is the world of EUV lithography, a ...
Nexperia China secures local power chip wafer supply for 2026 production China unit declared itself independent of European management two months ago Dispute over control of Nexperia led to suspension ...
As semiconductors push into environments once considered untenable, reliability expectations are being redefined. From the vacuum of space and the inside of jet engines to deep industrial automation ...
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