After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

Tower ( (TSEM)) just unveiled an announcement. On November 12, 2025, Tower Semiconductor announced the expansion of its 300mm wafer bonding technology to support heterogeneous 3D-IC integration across ...

The booming development of AI applications is accelerating the advancement of IC process production, with fabless chipmakers also upgrading manufacturing specifications for their new products, ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Semiconductors or integrated circuits are microelectronic devices made mostly of silicon or germanium. These chips, though tiny, comprise thousands of different components that work together to ...

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

The rapid growth of critical technologies such as 5G telecommunications and electric mobility demands higher power densities, faster switching frequencies, and greater thermal resilience than is ...

There is a fierce debate in the United States and among its allies about the impacts of export controls, and nowhere is that debate more heated than in the semiconductor equipment manufacturing ...