Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.
The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...
The W3EG2128M72AFSR 2-Gbyte registered ECC DDR SDRAM module consists of thirty-six 512-Mbit fine ball grid array (FBGA) packages mounted on a 184-pin DIMM. Structured as two ranks of 128-M x 72-bit ...
The WV3EG232M64EFSU-D4 is a 2 x 32M x 64 double data-rate (DDR)SDRAM unbuffered memory module based on 256 MB SDRAM components. It consists of sixteen 32 MB x 8 DDR SDRAMs in a fine ball-grid array ...
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