A new paradigm for semiconductor manufacturing test is coming. Unfortunately, it’s not yet completely defined, and most manufacturers still retain the traditional split between so-called front-end and ...

The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the ...

A few years ago, the semiconductor lingo for automated test equipment (ATE) PCBs was “load boards.” But more recently, they’ve become increasingly known in semiconductor parlance as “device interface ...

Load-board design is a critical part of any project that uses ATE to test integrated circuits. Load boards provide the interface between the ATE and the device under test (DUT). A properly designed ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.